包金与电镀厚金工艺厚度对比

Comparison between gold plating and thick gold electroplating

The core differences between the two precious metal surface treatment processes are intuitively demonstrated through thickness comparison

Thick gold plating

Cost-effective choice
金层: 0.5-3.0µm
基底: 黄铜
Gold layer thickness 0.5-3.0 µm

Process Principle

Pure gold or K gold ions are evenly deposited on the surface of the base metal through the principle of electrolysis to form a dense and bright gold layer.

Core Advantages

  • The gold layer is uniform and dense, mirror-like and bright
  • Cost-effective and suitable for mass production
  • Suitable for complex designs and fine coloring
  • Good resistance to wear and discoloration
  • Short delivery cycle and high production efficiency

Applicable Scenarios

Fashion jewelry, fast fashion brand lines, intricately designed and budget-sensitive products can maintain their luster for 1-3 years with normal wear.

Gold filled

The ultimate durable choice
金层: 5-25µm
基底: 黄铜
金层厚度 5-25 µm

Process Principle

A layer of K gold foil is mechanically wrapped around the metal, and then subjected to high temperature and high pressure treatment to combine the two into one.

Core Advantages

  • Thick gold layer, high-quality texture
  • Superior durability and excellent scratch resistance
  • Long-term color retention, service life can reach more than 5 years
  • Suitable for people with sensitive skin
  • Strong sense of quality, enhancing product value

Applicable Scenarios

Mid- to high-end jewelry brands, designer brands, and classic styles that need to be worn long-term, such as necklaces, wedding rings, and other jewelry that are worn daily.

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